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5.6mm Power Bank Pcb Circuit 1 Layer To 20 Layers 100 E Testing

Shenzhen Betterliv Technology Co., Ltd.
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5.6mm Power Bank Pcb Circuit 1 Layer To 20 Layers 100 E Testing

Brand Name : Betterliv/OEM

Model Number : OEM

Certification : CE FCC ROHS

Place of Origin : Shenzhen,China

Payment Terms : T/T, Western Union, Credit Card

Product name : Power Supply Module Design PCBA

Silkscreen Color : Black.white.yellow.red.blue

SMT Efficiency : BGA.QFP.SOP.QFN.PLCC.CHIP

Board Thickness : 0.8-5.6mm

Min. Hole Size : 0.2mm

Surface Finishing : HALS/HALS OSP etc

Testing Service : 100% E-testing

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OEM Power Bank PCBA Electrical Circuit Board Power Supply Module Design PCBA

Product Details

PCB assembly Layers 1 Layers to 20 layer (standard, including HDI board )
PCB assembly material/type FR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger
PCB Assembly service type DIP/SMD or Mixed SMD & DIP
Base material thickness 0.2-3.6mm
Copper thickness 18um(H/HOZ),35um(1/1OZ),70um(2/2OZ),5OZ
Assembly surface finish Gold-plated, HASL,OSP, ENIG
PCB Dimension (max) 500*700mm
IC Pitch(min) 0.2mm
Chip size(min) 01005
Drilled hole size(min) 0.075mm
Track width/spacing(min) 3mil
IC Encapsulation type SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
Outline tolerance ±0.1mm
Hole diameter tolerance ±0.076mm
Hole location tolerance ±0.076mm
V-CUT tolerance ±0.1mm

PCB/PCBA capability and services
1. Singlesided PCB, double side PCB & multilayer PCB with competitive price, good quality and excellent service.
2. FR-4, FR-4 High TG, CEM-1, CEM-3, Aluminum base material.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
5. Quantities range from prototype to medium and batch production.


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